Product

Semiconductor Packaging Materials

TAiCHEM provides a range of materials for use in semiconductor packaging, including temporary bonding, laser release, and warpage control films.

Explore Details
01

Laser De-bonding
02

Temporary Bonding
03

Warpage Control

Display Packaging Materials

TAiCHEM provides various Mini/Micro LED protective materials for packaging, and mass transfer films.

Explore Details

Mini LED Packaging Film

Micro LED Packaging Film

Mass Transfer Film