TAiCHEM develops display packaging materials, offering a wide range of protective materials for Mini/Micro LED packaging, as well as mass transfer film for mass transfer process.

These materials are designed with optimized chemical and physical properties. The packaging protection adhesive enhances RGB color efficiency through excellent gap-filling capability while protecting the LED chip structure.

The mass transfer film securely adheres to the chips, withstands chemical processes, and can be easily de-bonded using laser to achieve transfer objectives.