TAiCHEM specializes in material R&D for advanced semiconductor packaging processes, offering a wide range of temporary bonding, laser de-bonding, and warpage control films. These materials are specifically designed to provide excellent adhesion, outstanding heat, and chemical resistance.

TAiCHEM operates a Class 100 cleanroom and offers professional coating services for 8''and 12'' glass wafers, meeting diverse requirements for CTE, TTV and various thickness requests, as well as particle contamination standards.