Semiconductor Assembly Materials
Taichem offers a variety of materials for temporary bonding and direct adhesive in semiconductor packages. The laser de-bonding glue has high reliability, good chemical resistance and low power energy de-bonding characteristics. Moreover, Taichem also provides 12" glass carrier coating services with class 100 cleanroom to fulfill different specification on CTE, TTV, THK and particle size. Our high adhesive film (Filling Adhesive Film) with high thermal, high frequency insulation and warpage control properties can also be applied to Cu pillar space filling during RDL process.
Product Specifications
- Laser De-bonding Products
- Filling Adhesive Film Products
- Temporary Bonding Products
- Warpage Control Products
| Product type | Liquid glue | Film |
|---|---|---|
| Application | Spin coat on glass | Laminate on glass |
| Laser de-bond wavelength | 355,532,1064 | |
| Product characteristics | High thermal resistance | |
| High chemical resistance | ||
| High volume resistance | ||
| Product type | Film | |
|---|---|---|
| Application | Wafer via filling | Adhesive layer |
| Apply on wafer size | 8” & 12” (200mm &300mm) |
|
| Product characteristics | Good adhesion | |
| High tensile strength | ||
| Good tensile elongation | ||
| High thermal resistance | ||
| High volume resistance | ||
| Low water absorption rate | ||
| Product type | Liquid glue | Film |
|---|---|---|
| Application | 2.5D & 3D Advanced wafer level package process | |
| Process | Spin coat on glass or wafer | Laminate on glass |
| Product characteristics | High thermal resistance | |
| High chemical resistance | ||
| High Storage Modulus | ||
| Good adhesion | ||
| Product type | Film |
|---|---|
| Application | Package warpage control |
| Product characteristics | Good adhesion |
| High tensile strength | |
| High Storage Modulus | |
| High chemical resistance | |
| High thermal resistance | |
| Low CTE α1 | |
| High volume resistance |
Applications
