About Us
Founded in 2020, TAiCHEM is a wholly owned subsidiary of TAIFLEX, one of the world's leading FCCL manufacturers. We are devoted to developing and manufacturing advanced display and semiconductor packaging materials.
For semiconductor advanced packaging, TAiCHEM provides temporary bonding adhesives, laser release films, and warpage control films required for 2.5D, 3D, and Fan-Out PoP processes. Customized formulas are available based on customer requirements during the design and characterization phases.
To meet varying needs and reduce time to market, TAiCHEM operates a class 100 cleanroom with automated production and testing equipment, assisting customers in verifying, testing, and manufacturing fine-coating glass carriers. Additionally, we offer a high-adhesion "Filling Adhesive Film" with exceptional thermal performance, high-frequency insulation, and warpage control characteristics, which can be used for Cu pillar space filling in the RDL process.
For display packaging, in addition to offering the common materials used in Mini and Micro LED packaging, TAiCHEM has also developed mass transfer film for the Micro LED process, which enables high yield and process stability.
Leveraging its core technologies in specialized formulas and process development, TAiCHEM is capable of providing customized packaging materials based on customer needs.
Moving forward, Taichem will continue to invest in R&D of advanced material development for semiconductor advanced packaging, commit to bring sophisticated, high quality products and services as well as comprehensive and customized solutions to all our customers.